Welcome to Majelac Technologies

Majelac Technologies provides subcontract assembly services to the Semiconductor  & Optoelectronic industries.  We specialize in Quick Turn Assembly & Packaging of a large variety of package types. 

Services including Wafer Dicing, Die Bonding, Wire Bonding, Sorting, and Encapsulation are performed in a class 10000 clean room. We also utilize a class 1000 clean room and clean hoods for more critical applications.

We offer fine-pitch wire bonding down to 50 microns with three rows of bond pads.  We also assemble Flip Chip devices. Contact us today to learn more about our capabilities.


Send mail to webmaster@majelac.com with questions or comments about this web site.
Copyright © 2009 Majelac Technolgies Inc.
Last modified: September 18, 2012